Application material release chip process electron beam measurement system provision 3e

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On October 18, applied materials released the electron beam measurement system provision 3E today. Provision 3E supports the graphical control capabilities required for the most advanced chip design, including 3-nm wafer foundry logic chips, all surround gate transistors, the next generation DRAM and 3D NAND, providing a platform for measurement on large-scale chip devices The graphical control of cross wafer measurement and penetration measurement is supported.
According to applied materials, provision 3E system has been widely used by major wafer foundry logic chip, DRAM and NAND manufacturers all over the world.