SMIC’s debut: advanced technology and advanced packaging will develop


Original title: SMIC Jiang Shangyi’s debut: Moore’s law is close to the physical limit
According to the science and technology innovation board daily, the second annual meeting of SMIC was held today. Jiang Shangyi, vice chairman of SMIC, appeared and answered questions about the development direction of SMIC. It home understands that this is Jiang Shangyi’s first appearance after he joined SMIC.
Jiang Shangyi said:
The development of Moore’s law is close to the physical limit, and the current ecological environment is not applicable
Advanced technology will go on. Advanced packaging is a technology for the post Moore era. SMIC will develop in both advanced technology and advanced packaging.
Packaging and circuit board technology are relatively backward, and gradually become the bottleneck of system performance
Only a very small number of products in great demand can use the most advanced silicon technology
With the advent of the era of smart phones, the requirements for chips are different. There are many kinds of chips, which change rapidly, but the amount is not necessarily large
The chip supply chain is undergoing restructuring. Different applications need different chips, and the demand for chips is becoming diversified
The semiconductor application market has changed from the main chips in the hands of a few suppliers to the main chips no longer in the hands of a few manufacturers
The development trend of the post Moore era is to develop advanced packaging and circuit board technology, that is, integrated chip, which can make the tightness between chips and the overall system performance similar to a single chip
Our semiconductor industry needs to establish a complete ecological environment in order to win in the global market competition, including equipment + raw materials → silicon wafer process → packaging and testing → chip products → system products, and the cooperation of EDA tools, standard cells, IP’s, testing, inspection I on, etc., in order to achieve the optimization of system performance.
In addition, Wu Hanming, academician of the Chinese Academy of engineering and Dean of the school of micro nano electronics of Zhejiang University, also attended and delivered a speech. He said that there are three challenges in the chip manufacturing process, among which the basic challenge is precision graphics, the core challenge is new materials and new technologies, and the ultimate challenge is improving yield.