Successful research and development of high-end lead frame for optical semiconductor package


According to Ou Feiguang official account, the company developed the high-end lead-in framework for semiconductor packaging. It plans to start trial production in the first quarter of 2021 with the inverted electroless production line, and mass production in the second quarter of 2021.
It is reported that the lead frame is the most important packaging carrier of the chip, and also the channel for chip information to contact the outside world. However, the high-end etched lead frame market has been dominated by Japan and South Korea for a long time, and domestic enterprises are in a catch-up position all the year round.
In 2020, with the goal of localization substitution, ofI optical established a lead frame project, and successfully developed a high-end etching lead frame with large width, high density, ultra-thin and high reliability.
Based on the existing production line and production technology, ofight plans to start proofing and trial production in the first quarter of 2021 with flip chip non electroplating production line. At the same time, it will continue to strengthen research and development investment, establish Jiangxi core HENGCHUANG semiconductor company in Yingtan, Jiangxi Province, and create a new production line. It is expected that the developed various processes will be introduced into mass production with new production lines in the second quarter of 2021.