Lingming photonics, a chip company, has completed a round of financing of tens of millions of RMB


On June 23, Lingming photonics, a single photon sensor chip company, announced that it has completed tens of millions of RMB A1 rounds of financing. This round of financing is led by China light speed Investment Co., Ltd., followed by Oufei holdings. Jia Jieyang, co-founder and CEO of Lingming photonics, said the financing amount will be mainly used for R & D and productization, further improving the company’s technology and product solutions in the field of consumer dtof imaging chips and high-performance lidar receiving chips.
Lingming photon mainly develops large-scale integrated chips of high-efficiency single photon detector (SPAD). At present, it has two product lines: silicon photon multiplier tube (SIPM) for high-performance laser radar photon receiving scheme, spadis for consumer electronic products and overall dtof solution.