Taiwan Media: Hess is working hard to develop more chips, including CPU and GPU for computers.


Sina Technologies News, August 6, afternoon, according to Taiwan’s “Electronic Times” reported that Huawei insisted on independent research and development of chips in the past 10 years, has been completed by Haisi. However, in recent years, in Taiwan’s semiconductor upstream and downstream industry chain, Huawei has upgraded its plan to insist on independent research and development of chips in the face of current changes in the situation.
Supply chain stakeholders pointed out that Haise is currently developing and designing a variety of chips, from a series of chips used in mobile devices to CPU and GPU used in multimedia display chips and computers, and Haise is trying to produce new products. Moreover, the technology used by Hess chips is all focused on advanced manufacturing technology under 7 nanometers of TSMC, and the capacity of Taiwan’s back-end sealing plant and downstream PCB industry is also included.
Semiconductor sources revealed that Heise’s latest chip solutions are more focused on multimedia and computing technology. It is generally predicted that Heiss’s move is to fill the gap in technology outside of its main mobile device chips. But it may also be to meet the chip needs of Huawei’s smart display terminals positively laid out in the 5G era, and Huawei’s potential involvement in CPU and GPU solutions within laptops.
According to the report, recent developments in Huawei Haisi have highlighted that Huawei’s self-sufficient chip blueprint has been expanded outward, and this time it will be a joint operation of the army, Navy and air forces.
At present, Huawei has a series of chip product lines, such as Kirin, Baron, Hongkui, Lingxiao and Kuipeng. Haisi has recently launched a new chip development and production plan in TSMC, which shows that Huawei’s self-sufficient chip program is trying to expand its service content and influence level. Under the pressure that ARM has not completely prohibited intellectual property rights authorization for the time being, the reasons behind Huawei and Haisi’s full-fledged action are clear to the industry at a glance.
Industry analysts say that Huawei and Haisi have allocated all their resources and manpower to prevent possible re-escalation. It is an indisputable fact that Haisi has recently increased orders and added chips in advanced manufacturing technology of TSMC. At the present stage, Haisi has shifted from consumer electronics products to PC and laptop computers, and then to mobile. In terms of equipment product lines and finally Cloud Application services, Haise has hardly participated in them. Looking at the global chip design industry, almost no one can compete with it.
The report points out that after estimating the cost of developing a 7-nanometer process chip at the scale of hundreds of millions of dollars, Heiss’s capital expenditure plan for 2019 will not only exceed the standard, but may even be several times that of other first-line chip developers. The magnitude of this magnificence may be due to the pressure brought about by the changing situation, but it is undeniable. Apart from Huawei and Hess, probably no chip designer in the world has the means and ability to do this.