China Telecom took the lead in realizing full interoperability between SA terminal chips and multi-manufacturer systems.

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At the end of July, China Telecom announced that it had taken the lead in realizing the full interoperability of 5G SA (independent networking) terminal chip Balong 5000 with many manufacturers’systems, which marked that 5G SA commercial breakthroughs the terminal bottleneck.
The scarcity of SA terminal chips has always been the bottleneck restricting the development of 5G. The only Hess terminal chip supporting SA needs a lot of interworking and debugging with the mainstream equipment manufacturers. As a result, most SA pilot work can only use analog terminals in the early stage. The test capability and effect are greatly limited, which seriously restricts the development of 5G. In order to achieve full interoperability between SA terminal chips and systems, China Telecom Organization Haisi SA terminal chip Baron 5000 took the lead in completing the IoDT (interoperability research and development test) with Huawei system from March 2019, and successively developed IoDT with ZTE, Ericsson, Datang, Nokia and other manufacturers’systems, strictly following the 3GPP R15 2018 in the test. December Standard identifies and solves 15 important issues affecting chip and system docking. This test realizes the full interoperability between SA terminal chip and mainstream manufacturers’system, breaks through the predicament of lack of mobile terminal in SA networking test, and takes a key step towards SA commercial goal.
Based on the above IoDT results, China Telecom has adopted the mobile terminal based on Hess chip for SA networking outfield test. At the same time, China Telecom will promote more chip manufacturers and system manufacturers to carry out interoperability testing, and prosper the 5G industry ecology.